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| Datasheet File OCR Text: |
| geometry process details gross die per 5 inch wafer 3,137 process CPD38X schottky rectifier 8 amp schottky rectifier chip die size 72 x 72 mils die thickness 5.9 mils anode bonding pad area 64 x 64 mils top side metalization al/ni/au - 30,000?/4,000?/1,500? back side metalization ti/ni/au - 1,600?/5,550?/1,500? www.centralsemi.com r1 (29-april 2010)
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Price & Availability of CPD38X
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